Termékek csomagküldési szolgáltatások (2)

type BN-AA BN-AB BN-AT BN-AS BN-AY BN-AZ BN-SA BN-SC size 1-3um 4-8um 10-13um 15-20um 28-30um 7-9um 30-100um 100-150um Appearance Powder Color  White Particle Size  1-40um Purity 99.5% Hbn Boron Nitride Density 0.9-1.1 G/Ml at 25 °c pH  5-8 (100g/L, H2O, 20ºC)(Slurry) Melting Point  Sublimes SL Below 3000 Water Solubility  Soluble in Water Oxygen  <0.022%-0.1% Metallic  <0.2% Carbon 0.05% Technology High Frequency Plasma Method Transport Package Air Freight Safety Packing Origin China HS Code 2850000090 Production Capacity  50000tons Per Month

Grade AIN-HT140 AIN-HT170 AIN% >99.5% >99.5 Production Process Hot Pressing Hot Pressing Density >3.26 >3.26 Thermal conductivity >140 >170 Surfaceness <2 <2 Hardness 800 850 Flexural Strength >350 >350 Product performance and advantages 1.The product has high thermal conductivity and excellent electrical insulation performance. 2.The product has high room temperature strength and high temperature strength. 3.The product has a small coefficient of expansion and good thermal conductivity. 4.Advantages in high temperature resistance in non oxidizing atmospheres. 5.Resistant to corrosion of metals such as iron, aluminum, and alloys.  Typical applications 1.The product can be used as a high-temperature construction and heat exchanger material 2.Materials such as crucibles for metal melting, containers for vacuum evaporation plating 3.heat-resistant fixtures, etc 4.Microwave dielectric materials 5.High thermal conductivity aluminum nitride ceramic substrate 6.Synthesize high-quality LED fluorescent powder 7.Thermal conductive filler Application field: 1.Electronic packaging and ceramic substrates: The high thermal conductivity, electrical insulation, and thermal expansion coefficient of aluminum nitride, which matches semiconductor materials such as silicon, make it an ideal material for the new generation of heat dissipation substrates and electronic device packaging. It is suitable for packaging hybrid power switches and microwave vacuum tube packaging shell materials, and is also an ideal material for large-scale integrated circuit substrates. 2.Thermal conductive material filler: Aluminum nitride powder can improve the thermal conductivity of materials and is used in TIM (thermal interface materials), such as thermal adhesive, thermal grease, and FCCL thermal conductive dielectric layer filler. It is widely used as a heat transfer medium in electronic devices. 3.Structural ceramics: Aluminum nitride ceramic structural components have excellent properties such as high thermal conductivity, low dielectric loss, and good mechanical properties. They can be used to make semiconductor electrostatic suction cups, high-temperature corrosion-resistant components, and are widely used in semiconductor, medical, and other fields. 4.Other applications: Aluminum nitride can also be used as a basic raw material for vapor deposition crucibles, metal melting crucibles, and casting molds. Nano aluminum nitride can enhance the thermal conductivity, rigidity, and strength of matrix materials.